MOLDING - FLEXIBLE & RIGID CIRCUITRY OVERMOLDING
The premise for flex circuitry molding translates into chemically bonding with the material being injection molded. It is highly complex and involves know how and expertise in the tooling design and processing phases. The rigid circuitry is not chemically bonded but rather mechanically bonded to the injection molded material. If needed, bonding agents can be added to overcome this obstacle.